2012.02.08 // Posted by: Walt Custer // Posted in: Articles, Industry Conditions
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Last week the EIPC held its winter meeting in Prague. About 85 people attended, many from the Czech Republic’s local PCB and related electronics industries.
Download my presentation here: Custer EIPC Presentation Download
For further detail on EIPC membership or to obtain copies of the papers below contact
Mrs. Kirsten Smit-Westenberg, Executive Director, kwestenberg@eipc.org
08:30-08:45
Welcome by the EIPC Chairman
Announcement ECWC13
Rex Rozario, Graphic Plc, UK
Giacomo Angeloni, Somacis Spa, IT
08:45-09:15
Business outlook: Global electronics industry
Walt Custer, Custer Consulting Group, USA
09:15-09:45
OEM requirements for PCBs for future automotive electronics
Dr.- Ing. Patrik Hartherz, Robert Bosch GmbH, DE
09:45-10:15
Flexible printed circuits - Innovation in automotive electronics
Dr. Wolfgang Bochtler, Mektec Europe GmbH, DE
10:15-10:45
Attractiveness of Czech Republic for investors in the electronics, evaluation of the actual progress. Chances for engaging of investors also in smaller enterprises. Advantages of Czech industry toward the Far East.
CzechInvest, CZ
11:15-11:35
How clean is clean?
Graham Naisbitt, Gen3 Systems Limited, UK
11:35-11:55
PCB reliability made measurable
Hermann Reischer, Polar Instruments GmbH, AT
11:55-12:15
A distinctive, new class of PWB final finish
Johan Pellicaan, Enthone BV, NL
12:15-12:35
Waste water cleaning in electronics
Karel Vratny, VWS-Memsep, CZ
14:30
Factory tour Skoda
19.45
Networking Dinner
08:40-09:00
Halogen free flame retardants for printed circuit boards – technical developments and market trends
Adrian Beard, Clariant Produkte (Deutschland) GmbH, DE
09:00-09:20
Brominated flame retardants − status today
Willem Hofland, EFRA, NL
09:20-09:40
The advantages and importance of the European supply base
Alun Morgan, Isola Group, UK
09:40-10:00
PCB Technology road map and the European impact on the global Electronics market
Michael Weinhold, EIPC, DE
10:40-11:00
Improved surface treatment processes to increase PCB manufacturing yield
Dr. Peter Amann, KIV PCB ProfiChem GmbH, DE
11:00-11:20
Involvement of EIPC in EU projects to support the electronics Industry
Dr. Konrad Wundt, EIPC, DE (presented by Michael Weinhold)
11:20-11:40
Direct EP and EPAG on copper - surface finishes for the future
Jaime Peraza Ordaz, Atotech Europe, DE
11:40-12:00
InCam - The software of the 21st century
Claudio Bellistri, Orbotech SA, BE
12:00-12:20
AutoCam
Karel Tavernier, Ucamco, BE
13:30-13:50
Mechatronic: Advanced electronic device embedding technology as “Key for Success” in automotive and industry electronics
Thomas Hofmann, Hofmann Leiterplatten GmbH, DE
13:50-14:10
The mechatronics challenge for PCBs
Giacomo Angeloni, Somacis Spa, IT
14:10-14:30
HDI Boards: reliability considerations
Roberto Tulman, Eltek Ltd., IS
SIA recently released December’s semiconductor shipments to each region of the world. Here are a few brief comments:





The December U.S. Factory Orders report was just released:





Chart 11, Chart 12, and Chart 13 provide an overview of North American December printed circuit board activity based upon data from IPC.



Chart 14 summarizes the annualized (12/12) and 3-month (3-12) growth of the U.S. electronics supply chain. The 3/12 “leads” the 12/12.
