Presenter Bios: Keep Current! Learn More About High Power Connectors and Connection Systems.
September 26, 2006: Keep Current – Learn More About High Power Connectors and Connection Systems.
Today's leading edge electronics applications require more power to be packaged in higher densities and with less available space. Designers have greater concern over temperature rise, signal interference, and cost effectiveness. So join Amphenol, FCI, and Molex as they discuss their latest technologies in high power connector solutions and mixed power and signal connectors. This installment is moderated by TTI's Lew LaFornara and includes an introduction from Bob Hult of Bishop & Associates on the current market requirements and high power applications.
Moderator:
Lew LaFornara
Lew is Vice President of Supplier Marketing at TTI. He has more than 28 years experience in the electronic components industry working on both the manufacturing and component distribution sides of the business. While working for Amphenol Aerospace in the military/aerospace market and for FCI/Berg Electronics in the commercial connector market, LaFornara spent the majority of his career managing the distribution channel both domestically and globally. Prior to joining TTI, he was Vice President of Interconnect at Future Electronics and has experience with Avnet's Hamilton/Hallmark Electronics unit. In addition to his work experience he has served on the Board of Directors of NEDA, as well as on the Board of the NEDA Education Foundation.
Presenters:
Bob Hult, Contributing Member, Bishop & Associates
Bob has been in the connector industry for more than 36 years. Starting as a Sales Engineer with Amphenol in 1968, he joined AMP, Inc. in 1972 and held a variety of positions including District Product Manager, Manager Regional New Product Specialists, Advanced Packaging Products Manager, District Sales Manager, and Manager Field Applications / Manpower Development. In 1997 he joined Foxconn as Group Marketing Manager. He has been a contributing member of the Bishop & Associates team since 2002.
Bishop & Associates provides specialized services including, custom market research, multiple client studies, surveys, merger and acquisition assistance, and executive recruiting.
Steve Fitzgerald, Business Development Manager, Amphenol Industrial Corporation
Steve is currently Business Development Manager for Amphenol Industrial Operations' RADSOK® PowerBus business unit. He formerly held the positions of RADSOK® Product Manager and Application and Sales Engineer in the metro Detroit area (prior to Amphenol's acquisition of the RADSOK® business). Steve works closely with both external customers and internal engineering resources to develop unique interconnect products based on Amphenol's proprietary RADSOK® contact technology, meeting the demands for high current, low voltage power connectors in a wide variety of applications. Application experiences range from telecommunication backplane connectors to hybrid-electric military vehicles to offshore drilling rig hardware.
Scott Kleinle, Global Power Products Manager, FCI
Scott is currently the Global Power Products Manager for FCI CDC Division located in Harrisburg, Pa. Scott has been in the electronics industry for 13 years, working the last nine years for FCI/Berg. During Scott's tenure at FCI/Berg he has served in numerous product, business and market development roles typically focused on FCI's technology products. Scott holds a degree in electrical engineering as well as an MBA from Penn State.
Mike Bean, Product Manager, Molex
Michael is a Product Manager for power products in the Connector Product Division of Molex. He has been with Molex for 14 years and is a 25-year connector industry veteran in various sales, marketing, industry, and product positions. Currently, Michael is responsible for many of the new power products being released by Molex into the market place.